Method and system for mass arrangement of micro-component devices

ABSTRACT

A method for mass arrangement of micro-component devices includes the following process stages: disposing the micro-component devices to float on a liquid suspending medium, wherein the micro-component devices are spaced apart from each other with a larger initial gap along a first direction and along a second direction; using electromagnetic force to actuate the floating micro-component devices to move closer so that the micro-component devices become spaced apart from each other with a smaller specified target gap along the first and the second directions; and transferring the arranged micro-component devices with the target gap on a carrier substrate. A system for arranging the micro-component devices is also disclosed to implement the method. Therefore, a precisely arranged array of the micro-component devices can be formed on a target application substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of and priority to Taiwan PatentApplication No. 106135119 filed on Oct. 13, 2017, and Chinese PatentApplication No. 201710970476.1 filed on Oct. 16, 2017, the disclosuresof which are incorporated herein by reference in their entirety.

BACKGROUND Technical Field

The present disclosure relates to a method and system for arrangingcomponent devices, and more particularly to a method and system forarranging a large number of micro-component devices.

Description of the Related Art

Light-emitting diodes (LEDs) have been developed for decades. Inaddition to traditional LED applications, such as indicator lights,illumination sources, backlight modules for liquid crystal displays(LCD), and outdoor large-scale display panels, applications of LEDs arenow moving toward fine-pitch miniaturized LED (micro-LED) displaydevices. That is, through a semiconductor lithography processtechnology, the size of an LED chip can be fabricated at around amicrometer level. For example, the size of a micro-LED can be similar toor smaller than a pixel size of a display device. The micro-LED chipsare arranged into an array (a micro-LED array), transferred andelectrically bonded to an application circuit board having a drivingcircuit (in combination with other circuitry components), therebyforming a display device, wherein each pixel of the display device mayinclude one or a plurality of micro-LED chips, and each pixel iscontrolled by an array of active-matrix (AM) thin-film transistors (TFT)or passive-matrix (PM) driving integrated circuits (ICs) to form thedisplay device. A display device comprising a plurality of micro-LEDchips is referred to as a micro-LED display device.

Compared with an organic light-emitting diode (OLED), since a micro-LEDchip is composed of an inorganic material, the micro-LED chip is lesssusceptible to moisture and oxygen from the environment, and can have alonger lifetime. In addition, the emitting spectrum of a micro-LED chiphas a narrower Full Width at Half Maximum (FWHM), so a display devicecomprising micro-LED chips has a higher color purity and can reach awider color gamut. Furthermore, the electroluminescent conversionefficiency of the micro-LED chip is much higher than a comparable OLED,so that the micro-LED chip can be used to make a high-brightness displaydevice by using a small size of a light emitting area. Therefore, evenif the light emitting area of the micro-LED chip occupies a smallportion of the overall area in a single pixel, it is sufficient toproduce a high-definition contrast display device.

In addition, it is difficult to form a uniform thin film using anorganic light-emitting material during the manufacturing process of OLEDdisplay devices, resulting in a so-called Mura effect. On the otherhand, micro-LED chips can be pre-tested according to their electricaland optical properties after fabricating the micro-LED chips, and thenthe micro-LED chips with similar electrical and optical properties canbe sorted and bonded on the same display device. Therefore, the displaydevice made by the micro-LED chips with relatively similar electricaland optical properties can avoid the uneven-color Mura effects.

Even though a micro-LED display device has the above-mentioned technicalmerits, however, when a large number of micro-LED chips sorted bysimilar electrical and optical properties are used to manufacture thedisplay device, some technical challenges arise and should be overcomeor improved. For example, challenges arise in how to accurately arrangea large number of micro-LED chips into a micro-LED array to form adisplay device, how to transfer and electrically bond the array ofmicro-LEDs to a circuit board with a driving circuit to form a micro-LEDdisplay device, and the like. Especially for high-resolution displaydevices, it may take more than a million micro-LED chips to be arrangedand transferred, making the micro-LED display fabrication processchallenging and time consuming.

Therefore, there is a need for a method and system to accurately andefficiently arrange micro-LED chips (or other micro-component devices)into an orderly array and/or transfer the micro-LED chip array onto anapplication circuit board.

SUMMARY

One object of some embodiments of the present disclosure is to provide amethod and system for arranging a plurality of micro-component devices,wherein the plurality of micro-component devices can be arranged into anarray accurately and effectively, and allow subsequent manufacturingprocesses such as mass transfer of the micro-component devices betweensubstrates.

In order to achieve the above object, a method of arrangingmicro-component devices according to some embodiments of the presentdisclosure comprises: disposing a plurality of micro-component devicesto float on a surface of a liquid suspending medium, wherein themicro-component devices are initially spaced apart with afirst-direction initial gap along a first direction and initially spacedapart with a second-direction initial gap along a second direction, thefirst direction being transverse (e.g., substantially perpendicular) tothe second direction; actuating the micro-component devices floating onthe surface of the liquid suspending medium to move into closerproximity by using electromagnetic forces, so that the micro-componentdevices have a first-direction target gap along the first direction anda second-direction target gap along the second direction, wherein thefirst-direction target gap and the second-direction target gap aresmaller than the corresponding first-direction initial gap and thecorresponding second-direction initial gap, respectively; andtransferring the micro-component devices floating on the surface of theliquid suspending medium onto a carrier substrate, wherein themicro-component devices are arranged at intervals with the correspondingfirst-direction target gap along the first direction and thecorresponding second-direction target gap along the second direction.

In order to achieve the above object, a method of arrangingmicro-component devices according to some embodiments of the presentdisclosure comprises: disposing a plurality of micro-component devicesto float on a surface of a liquid suspending medium, wherein themicro-component devices are initially spaced apart in an initial arraywith an initial density; actuating the micro-component devices floatingon the surface of the liquid suspending medium to move into closerproximity by using electromagnetic forces, so that the micro-componentdevices are spaced apart in a target array with a target density that ishigher than the initial density; and transferring the micro-componentdevices floating on the surface of the liquid suspending medium onto acarrier substrate, while maintaining the target density.

In order to achieve the above object, a micro-component devicearrangement system according to some embodiments of the presentdisclosure comprises: a liquid chamber module comprising a liquidchamber for accommodating liquid suspending medium; and amicro-component device arrangement module comprising a conductive wireassembly, wherein the conductive wire assembly includes a plurality offirst conductive wires along a first direction and a plurality of secondconductive wires along a second direction. The first conductive wiresand the second conductive wires are disposed in the liquid chamber, andthe first direction is transverse (e.g., substantially perpendicular) tothe second direction. The conductive wire assembly defines an array ofgrids, each of which is defined by the two adjacent and parallel firstconductive wires and two adjacent and parallel second conductive wires.

Thereby, the method and system for arranging micro-component devicesaccording to some embodiments of the present disclosure can provide atleast the following technical benefits. (1) Compared with apick-and-place method, wherein a small number of micro-component devicescan be transferred sequentially, a mass arrangement method using themicro-component device arrangement method and system according to someembodiments of the present disclosure can arrange an array ofmicro-component devices simultaneously by: disposing the micro-componentdevices to float on the surface of the liquid suspending mediumsimultaneously, actuating the micro-component devices to move closer inproximity to each other by using the electromagnetic force, and thentransferring a large number of the micro-component devices from theliquid suspending medium to the carrier substrate simultaneously toeffectively and precisely form an array of the micro-component deviceswith a specified target pitch. (2) By applying electrical energy to theconductive wire assembly to generate attractive magnetic forces amongthe conductive wires, a grid opening of the conductive wire assembly canbe reduced in size and can be actuated so as to move the micro-componentdevices into closer proximity. (3) The first-direction target gap andthe second-direction target gap between the micro-component devices canbe accurately controlled by wire diameters of the conductive wires alongthe second direction and the first direction, respectively. That is, theconductive wires with different wire diameters can be used to adjust thecorresponding target gap between the micro-component devices alongdifferent directions. (4) The carrier substrate can be an applicationcircuit board with a built-in or integrated driving circuit, and thearranged array of the micro-component devices can be directly masstransferred from the liquid suspending medium to the application circuitboard simultaneously, so as to omit another mass transfer process of themicro-component devices.

Other aspects and embodiments of the disclosure are also contemplated.The foregoing summary and the following detailed description are notmeant to restrict the disclosure to any particular embodiment but aremerely meant to describe some embodiments of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flow chart showing process stages of a method of arranging aplurality of micro-component devices into an orderly array according toan embodiment of the present disclosure.

FIG. 2A, FIG. 2B, FIG. 2C, FIG. 2D, and FIG. 2E are schematic views ofvarious configurations of the micro-component devices that can bearranged using the method as illustrated in FIG. 1.

FIG. 3A, FIG. 3B, and FIG. 3C are schematic diagrams (top view, sideview, and front view) of process stages of arranging a low-density arrayof micro-component devices, wherein the process stages can be part ofthe method of arranging the micro-component devices as illustrated inFIG. 1.

FIG. 4A, FIG. 4B, and FIG. 4C are schematic diagrams showing processstages of providing a conductive wire assembly, wherein the processstages can be part of the method of arranging the micro-componentdevices as illustrated in FIG. 1.

FIG. 5A, FIG. 5B, and FIG. 5C are schematic diagrams showing processstages of disposing micro-component devices to float on a surface of aliquid suspending medium, wherein the process stages can be part of themethod of arranging the micro-component devices as illustrated in FIG.1.

FIG. 6A, FIG. 6B, and FIG. 6C are schematic diagrams showing processstages of actuating micro-component devices to move closer in proximityalong one direction, wherein the process stages can be part of themethod of arranging the micro-component devices illustrated in FIG. 1.

FIG. 6D and FIG. 6E are schematic diagrams showing process stages ofactuating micro-component devices to move closer in proximity alonganother direction, wherein the process stages can be part of the methodof arranging the micro-component devices illustrated in FIG. 1.

FIG. 7A and FIG. 7B are schematic diagrams showing process stages oftransferring micro-component devices onto a carrier substrate, whereinthe process stages can be part of the method of arranging themicro-component devices illustrated in FIG. 1.

FIG. 8A and FIG. 8B are schematic diagrams showing process stages ofremoving a conductive wire assembly, wherein the process stages can bepart of the method of arranging the micro-component devices illustratedin FIG. 1.

FIG. 9A, FIG. 9B, FIG. 9C, and FIG. 9D are schematic diagrams showingprocess stages of a method of arranging a plurality of micro-componentdevices according to another embodiment of the present disclosure,wherein the schematic diagrams illustrate the process stages ofarranging the micro-component devices as a lower-density array.

FIG. 10 is a schematic diagram illustrating a micro-component devicearrangement system in accordance with an embodiment of the presentdisclosure.

DETAILED DESCRIPTION Definitions

The following definitions apply to some of the technical aspectsdescribed with respect to some embodiments of the disclosure. Thesedefinitions may likewise be expanded upon herein.

As used herein, the singular terms “a,” “an,” and “the” may includeplural referents unless the context clearly dictates otherwise. Thus,for example, reference to a layer can include multiple layers unless thecontext clearly dictates otherwise.

As used herein, the term “set” refers to a collection of one or morecomponents. Thus, for example, a set of layers can include a singlelayer or multiple layers. Components of a set also can be referred to asmembers of the set. Components of a set can be the same or different. Insome instances, components of a set can share one or more commonproperties.

As used herein, the term “adjacent” refers to being near or adjoining.Adjacent components can be spaced apart from one another or can be inactual or direct contact with one another. In some instances, adjacentcomponents can be connected to one another or can be formed integrallywith one another. In the description of some embodiments, a componentprovided “on” or “on top of” another component can encompass cases wherethe former component is directly on (e.g., in direct physical contactwith) the latter component, as well as cases where one or moreintervening components are located between the former component and thelatter component. In the description of some embodiments, a componentprovided “underneath” another component can encompass cases where theformer component is directly beneath (e.g., in direct physical contactwith) the latter component, as well as cases where one or moreintervening components are located between the former component and thelatter component.

As used herein, the terms “connect,” “connected,” and “connection” referto an operational coupling or linking. Connected components can bedirectly coupled to one another or can be indirectly coupled to oneanother, such as via another set of components.

As used herein, the terms “about”, “substantially”, and “substantial”refer to a considerable degree or extent. When used in conjunction withan event or circumstance, the terms can refer to instances in which theevent or circumstance occurs precisely as well as instances in which theevent or circumstance occurs to a close approximation, such asaccounting for typical tolerance levels of the manufacturing operationsdescribed herein. For example, when used in conjunction with a numericalvalue, the terms can encompass a range of variation of less than orequal to ±10% of that numerical value, such as less than or equal to±5%, less than or equal to ±4%, less than or equal to ±3%, less than orequal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%,less than or equal to ±0.1%, or less than or equal to ±0.05%. Forexample, a first numerical value can be deemed to be “substantially” thesame as a second numerical value if the first numerical value is withina range of variation of less than or equal to ±10% of the secondnumerical value, such as less than or equal to ±5%, less than or equalto ±4%, less than or equal to ±3%, less than or equal to ±2%, less thanor equal to ±1%, less than or equal to ±0.5%, less than or equal to±0.1%, or less than or equal to ±0.05%. For example, “substantially”transparent can refer to a light transmittance of at least 70%, such asat least 75%, at least 80%, at least 85% or at least 90%, over at leasta portion or over an entirety of the visible spectrum. For example,“substantially” flush can refer to two surfaces within 20 micrometers oflying along a same plane, such as within 10 micrometers of lying alongthe same plane, or within 5 micrometers of lying along the same plane.For example, “substantially” parallel can refer to a range of angularvariation relative to 0° that is less than or equal to ±10°, such asless than or equal to ±5°, less than or equal to ±4°, less than or equalto ±3°, less than or equal to ±2°, less than or equal to ±1°, less thanor equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to±0.05°. For example, “substantially” perpendicular can refer to a rangeof angular variation relative to 90° that is less than or equal to ±10°,such as less than or equal to ±5°, less than or equal to ±4°, less thanor equal to ±3°, less than or equal to ±2°, less than or equal to ±1°,less than or equal to ±0.5°, less than or equal to ±0.1°, or less thanor equal to ±0.05°.

As shown in FIG. 1 is an embodiment of the present disclosure, whereinan arrangement method for micro-component devices (hereinafter referredto as an arrangement method) S100 is illustrated. The method includesthe following process stages: Process Stage S101—forming alower-precision array of micro-component devices with a larger initialgap along the first direction and the second direction; Process StageS103—providing a conductive wire assembly; Process Stage S105—disposingthe micro-component devices to float on a surface of a liquid suspendingmedium; Process Stage S107—forming a higher-precision array ofmicro-component devices with a smaller target gap along the firstdirection and the second direction; Process Stage S109—transferring aresulting arranged array of the micro-component devices onto a carriersubstrate; and Process Stage S111—removing the conductive wire assembly.Thereby, the arrangement method S100 can be used to arrange a pluralityof micro-component devices 10 (such as shown in FIG. 2A) into an orderlyarray rapidly, conveniently, and precisely.

The micro-component devices 10 forming an arranged array using thearrangement method S100 may include components of a micrometer-scalesize such as radio frequency components, micro-electro-mechanicalcomponents, LED chips, or LED packages. As illustrated in FIG. 2A andFIG. 2B, in one embodiment, each micro-component device 10 can be an LEDchip 11, which can be a flip-chip type LED chip that emits light of aspecific wavelength (color). For example, the LED chip 11 may be a blueLED chip that emits blue light, a red LED chip that emits red light, ora green LED chip that emits green light. In addition, the light emittedby adjacent LED chips 11 may be of the same wavelength or of differentwavelengths.

Structurally, the LED chip 11 includes an upper surface 111, a lowersurface 112, an edge surface 113, and a set of electrodes 114. The uppersurface 111 and the lower surface 112 are substantially in parallel andoppositely disposed, and the edge surface 113 is formed between theupper surface 111 and the lower surface 112, and connecting a peripheryof the upper surface 111 and a periphery of the lower surface 112. Inother words, the edge surface 113 is formed along an edge of the uppersurface 111 and an edge of the lower surface 112. The set of electrodes114 is disposed on or adjacent to the lower surface 112 and may havemore than two electrodes. Since the set of electrodes 114 is disposedthereon, the lower surface 112 is also referred to as an electrodesurface. In other words, the electrode surface does not refer to a lowersurface of the set of electrodes 114.

In general, the volumetric mass density (the ratio of mass to volume) ofthe LED chip 11 is higher than that of a liquid, so that the selectionof a liquid suspending medium on which the micro-component device 10 canfloat should be considered. Therefore, in another embodiment as shown inFIG. 2C, the micro-component device 10 includes an LED chip 11 and anauxiliary structure 12 having a lower mass density so as to reduce theoverall mass density of the micro-component device 10. Specifically, theauxiliary structure 12 is disposed on the upper surface 111, and/ordisposed along the edge surface 113 of the LED chip 11, and the massdensity of the auxiliary structure 12 is specified to be smaller thanthe mass density of the LED chip 11. The auxiliary structure 12 can bemade of an organic polymer material, for example an encapsulantpackaging material, or a photoresist material, so that the mass densityis significantly smaller than that of a material of the LED chip 11,such as at least about 1.5 times smaller, at least about 2 timessmaller, or at least about 3 times smaller. For example, the massdensity of the auxiliary structure 12 is about 1 g/cm³, and the massdensity of the material of the LED chip 11 (such as sapphire or galliumnitride) is about 4 g/cm³ to about 6 g/cm³.

Therefore, by providing the auxiliary structure 12 of a certainthickness (or width) and volume, the mass density of the overallmicro-component device 10 can be greatly reduced, and thus moreselections are available for the liquid suspending medium capable offloating the micro-component device 10. The greater the thickness (andthe volume) of the auxiliary structure 12, the smaller the overall massdensity of the micro-component devices 10. Therefore, the desiredthickness of the auxiliary structure 12 is a design parameter to specifythe desired overall mass density of the micro-component devices 10.

The auxiliary structure 12 can be directly formed on an LED wafer beforeit is singulated as a plurality of LED chips 11, by wafer-levelspraying, spin coating or printing the organic polymer material on theupper surface 111 of the LED chip 11. Thereafter, a dicing process isperformed to form the singulated LED chip 11 with the auxiliarystructure 12 to form the desired micro-component device 10.

As illustrated in FIG. 2D is another embodiment, wherein themicro-component device 10 can be a thin-film LED chip 11′, which issimilar to the LED chip 11, but omits an epitaxial substrate such assapphire. That is, the thickness of the LED chip 11′ is smaller than aflip-chip LED chip. In another embodiment as illustrated in FIG. 2E, themicro-component device 10 includes a thin-film LED chip 11′ and anauxiliary structure 12 disposed on the thin-film LED chip 11′, where theauxiliary structure 12 serves to adjust and lower the overall massdensity of the micro-component device 10.

The arrangement method S100 can be used to arrange various exampleembodiments of the micro-component device 10 including the aboveenumerated devices. It will be appreciated that the arrangement methodS100 can be used to arrange other micro-component devices beyond theabove example embodiments. In the following descriptions, the technicaldetails of each process stage are further explained. Before implementingthe mass arrangement technique according to some embodiments of thepresent disclosure, the micro-component devices 10 having relativelysimilar electrical and optical properties can be initially tested andsorted.

As illustrated in FIG. 3A to FIG. 3C, process stage S101 (shown inFIG. 1) is first performed to arrange a plurality of micro-componentdevices 10 into a lower-precision (or lower-density) initial arrayhaving an initial density of the micro-component devices 10.Specifically, the micro-component devices 10 are disposed on a temporarycarrier substrate 20, and the micro-component devices 10 can be, forexample, adhered to the temporary carrier substrate 20, or adsorbed onthe temporary carrier substrate 20. If by adsorption, the temporarycarrier substrate 20 can have a plurality of suction holes (not shown)connected to a source of negative pressure (e.g., a vacuum pump) tocreate suction force to adhere the micro-component devices 10. On thetemporary carrier substrate 20, the micro-component devices 10 arespaced apart from each other along a first direction D₁ by afirst-direction initial gap G₁ and along a second direction D₂ by asecond-direction initial gap G₂. The first direction D₁ and the seconddirection D₂ are horizontal directions, and are transverse to each other(e.g., substantially perpendicular) and are substantially perpendicularto a thickness (vertical) direction of the micro-component devices 10.The initial gaps G₁ and G₂ can be substantially the same or different.

The first-direction initial gap G₁ and the second-direction initial gapG₂ may be multiple times, for example, about 2 times, about 5 times, orabout 10 times, of a target gap along the first direction and the seconddirection (e.g., a first-direction target gap G₁′ and a second-directiontarget gap G₂′ described later) specified for a final arrangement of themicro-component devices 10. Therefore, the array formed by thefirst-direction initial gap G₁ and the second-direction initial gap G₂of the micro-component devices 10 has a lower array density. Inaddition, when the micro-component devices 10 are arranged, it is notnecessary to precisely control the initial gaps G₁ and G₂ between themicro-component devices 10. In other words, the initial gaps G₁ and G₂allow a larger tolerance range between the micro-component devices 10along the first direction D₁ and the second direction D₂. Furthermore,there is no stringent criterion for the orientation angle of themicro-component devices 10 for this lower-precision array. Therefore,the micro-component devices 10 can be arranged on the temporary carriersubstrate 20 rapidly, and at lower cost (allowing omission of use of ahigher precision instrument).

The micro-component devices 10 can be disposed one by one on thetemporary carrier substrate 20, for example, by picking and placing.Alternatively, the micro-component devices 10 can be disposed on anadhesive film such as a blue tape and then moderately expanding theadhesive film to form a lower-density array of micro-component devices10 with the first-direction initial gap G₁ and the second-directioninitial gap G₂. Next, the lower-density array of micro-component devices10 can be batch transferred to the temporary carrier substrate 20.

As illustrated from FIG. 4A to FIG. 4C, process stage S103 (shown inFIG. 1) is followed to provide a conductive wire assembly 30 surroundingthe micro-component devices 10. Specifically, the conductive wireassembly 30 includes a plurality of first conductive wires 31 and aplurality of second conductive wires 32. The first conductive wires 31extend substantially in parallel along the first direction D₁, and thesecond conductive wires 32 extend substantially in parallel along thesecond direction D₂. In other words, the first conductive wires 31 aresubstantially in parallel and are spaced apart along the seconddirection D₂, and the second conductive wires 32 are substantially inparallel and are spaced apart along the first direction D₁. In addition,the first conductive wires 31 are located above or below the secondconductive wires 32, or the first conductive wires 31 may be intertwinedwith the second conductive wires 32. The first and the second conductivewires 31 and 32 can be disposed in an un-tensioned state, so they canmove freely by attractive or repulsive forces.

By alternatively arranging the first conductive wires 31 and the secondconductive wires 32, the conductive wire assembly 30 can define aplurality of grids (or grid openings) 33, each grid 33 being defined byand composed of two adjacent and substantially parallel first conductivewires 31 and two adjacent and substantially parallel second conductivewires 32. The dimensions of the grid 33 along the first direction D₁ andthe second direction D₂ are r₂ and r₁, respectively, which may be thefirst direction initial gap G₁ and the second-direction initial gap G₂between the micro-component devices 10 described above. r₂ and r₁ can besubstantially the same or different.

The first and the second conductive wires 31 and 32 then surround themicro-component devices 10 such that the micro-component devices 10 arerespectively located in respective ones of the grids 33. That is, theedge surfaces 113 of each of the micro-component devices 10 are adjacentto a pair of first conductive wires 31 and a pair of second conductivewires 32.

The first and the second conductive wires 31 and 32 can be energizedwith electricity to generate magnetic forces that attract each other; soeach of the first and the second conductive wires 31 and 32 desirablycomprises a core with high conductivity (e.g., gold, copper, aluminum,or another metal, or a superconductivity material) to generate astronger magnetic field. In addition, each the first and the secondconductive wires 31 and 32 further comprises an insulating coatingcovering the core to avoid short circuits between the first and thesecond conductive wires 31 and 32.

On the other hand, the wire diameters of the first and the secondconductive wires 31 and 32 correspond to the second-direction target gapG₂′ and the first-direction target gap G₁′ specified for the finalarrangement of the micro-component devices 10. Taking a 5.5-inch displaywith a resolution of 1920×1080 as an example, a sub-pixel size is about63.4 μm×about 21.1 μm, and the target gap between the micro-componentdevices 10 is as small as about 0.01 mm to about 0.02 mm (or about 10 μmto about 20 μm). Therefore, the first and the second conductive wires 31and 32 can be selected from those having a wire diameter of about 0.01mm to about 0.02 mm. Conductive wires having a micrometer wire diameter,for example, can be obtained from, but not limited to, those conductivefiber manufacturers such as available under the trademark of GoodFellow®or the trademark of SWICOFIL®, or may be fabricated using a protrusionor a micro machining method. In addition, the first and the secondconductive wires 31 and 32 may be selected with different wire diametersso that the micro-component devices 10 may have different pitches in thefirst direction and the second direction.

Both terminals of each of the first and the second conductive wires 31and 32 can be electrically connected to a power supply 34 (as shown inFIG. 10), and the power supply 34 can provide a specific DC current (inAmperes) through the first and the second conductive wires 31 and 32 togenerate a magnetic force. Specifically, the wire diameters of the firstand the second conductive wires 31 and 32 determine a maximum DC currentthat the first and the second conductive wires 31 and 32 can sustain andtherefore the magnetic force generated. The technical details will befurther explained and illustrated in FIG. 6A to FIG. 6D.

As illustrated from FIG. 5A to FIG. 5C, process stage S105 (shown inFIG. 1) is then performed to dispose the micro-component devices 10 tofloat on a surface of a liquid suspending medium 40F. Specifically, themicro-component devices 10 and the temporary carrier substrate 20 areplaced in a container such as a liquid chamber 40 (as shown in FIG. 10),and then the liquid suspending medium 40F is injected into the liquidchamber 40 so that the liquid suspending medium 40F covers the temporarycarrier substrate 20 (e.g., the temporary carrier substrate 20 isentirely immersed in the liquid suspending medium 40F) and contacts theedge surfaces 113 of the LED chips 11 of the micro-component devices 10.The liquid suspending medium 40F may also cover the upper surfaces 111of the micro-component devices 10. After the liquid suspending medium40F covers the temporary carrier substrate 20 and at least contacts theedge surfaces 113 of the LED chips 11, the injection of the liquidsuspending medium 40F is stopped. At this time, the first and the secondconductive wires 31 and 32 may also be covered by the liquid suspendingmedium 40F.

Next, the micro-component devices 10 are detached from the temporarycarrier substrate 20 and floated in the liquid suspending medium 40F.That is, the micro-component devices 10 are temporarily attached to thetemporary carrier substrate 20 by way of an adhesive or adsorption. Ifan adhesive method is used, it can be deactivated by heating orirradiating with ultraviolet light. If an adsorption method is used, itcan be detached by stopping the operation of the negative pressuresource, so that the adsorption is released. Therefore, themicro-component devices 10 are no longer attached to the temporarycarrier substrate 20 and are free to move. At this time, since the massdensity of the liquid suspending medium 40F is higher than the overallmass density of the micro-component devices 10, the liquid suspendingmedium 40F provides a buoyancy force to detach the micro-componentdevices 10 from the temporary carrier substrate 20 and float in theliquid suspending medium 40F. The floating micro-component devices 10can be completely immersed in the liquid suspending medium 40F orpartially exposed from the surface of the liquid suspending medium 40F.After the micro-component devices 10 are detached from the temporarycarrier substrate 20, the temporary carrier substrate 20 is removed orcan remain placed in the liquid suspending medium 40F. The verticalheights of the first and the second conductive wires 31 and 32 can beadjusted by the mechanism of the conductive wire assembly 30, or floatedin the liquid suspending medium 40F, so that it is substantially in thesame height relative to the floating micro-component devices 10.

The liquid suspending medium 40F having a higher mass density, forexample, can be selected from, but not limited to, an electronicchemical liquid available under the trademark of Fluorinert™ (massdensity of about 1.85 g/cm³) available from 3M®, bromoform (CHBr₃, massdensity of about 2.889 g/cm³), di-iodomethane (CH₂I₂, mass density ofabout 3.325 g/cm³) or iodoform (CHI₃, mass density about 4.008 g/cm³).

Since the buoyancy of the liquid suspending medium 40F causes or mainlycauses the micro-component devices 10 to move vertically up slightly,the micro-component devices 10 can freely move horizontally whensubjected to a lateral force, and the buoyancy should not cause themicro-component devices 10 to greatly traverse in the first direction D₁and the second direction D₂. Therefore, the floating micro-componentdevices 10 can still be spaced apart from each other while preservingthe first-direction initial gap G₁ and the second-direction initial gapG₂ in a form of an array. In addition, desirably, the mass density ofthe liquid suspending medium 40F is slightly higher than the massdensity of the micro-component devices 10 (e.g., up to about 1.5 timeshigher, up to about 1.4 times higher, or up to about 1.3 times higher)so that the micro-component devices 10 can be gently moved up anddetached from the temporary carrier substrate 20 to reduce thefluctuation of the liquid suspending medium 40F during the upward motionof the micro-component devices 10. Furthermore, if each micro-componentdevice 10 includes the auxiliary structure 12 disposed on the uppersurface 111, since the mass density of the auxiliary structure 12 isspecified to be smaller than the mass density of the LED chip 11, duringthe upward movement, the auxiliary structure 12 tends to stay upward andthe set of electrodes 114 of the LED chip 11 tends to stay downward toform a stable state in the liquid suspending medium 40F.

In the present embodiment, after the micro-component devices 10 aredisposed and located in the grids 33 of the conductive wire assembly 30,the liquid suspending medium 40F is then injected to float themicro-component devices 10. In other embodiments, the liquid suspendingmedium 40F may be first injected to float the micro-component device 10,and then the conductive wire assembly 30 is provided to surround themicro-component devices 10. Therefore, the sequence of process stagesS103 and S105 can be switched in order.

As illustrated from FIG. 6A to FIG. 6E, an electromagnetic force isgenerated on the conductive wire assembly 30 to perform process stageS107 (as shown in FIG. 1) to actuate the floating micro-componentdevices 10 to move closer to form a higher-precision (or higher density)target array having a higher target density of the micro-componentdevices 10. Specifically, as shown from FIG. 6A to FIG. 6C, a DC currentI₁ is applied to the first conductive wires 31 along the first directionD₁ to generate a magnetic field on each of the first conductive wires31. The DC current I₁ of each of the first conductive wire 31 issubstantially in the same direction, so that the generated magneticfields are also substantially in the same direction. By Ampère's forcelaw, the first conductive wires 31 are attracted to each other andactuated to move closer along the second direction D₂. Consequently, thesize r₁ of the grids 33 is also reduced. As such, the first conductivewires 31 will actuate the micro-component devices 10 against the edgesurfaces 113 of the micro-component devices 10 such that themicro-component devices 10 also move closer along the second directionD₂.

As shown from FIG. 6D and FIG. 6E, a DC current I₂ is applied to thesecond conductive wires 32 along the second direction D₂ to generateanother magnetic field, and the second conductive wires 32 are attractedto each other along the first direction D₁. Therefore, the secondconductive wires 32 are moved closer along the first direction D₁, andthe size r₂ of the grids 33 is also reduced. As such, the secondconductive wires 32 will actuate the micro-component devices 10 closertogether along the first direction D₁. The applied DC current on thesecond conductive wires 32 may be performed simultaneously with theapplied DC current on the first conductive wires 31 or sequentially.

For example, by applying DC currents I₁ and I₂ to the first and thesecond conductive wires 31 and 32, the micro-component devices 10 can beactuated along the second direction D₂ and along the first direction D₁due to electromagnetic attraction. Due to contraction in size of thegrids 33, an array of a higher density is thereby formed and arrangedwith a first-direction target gap G₁′ and a second-direction target gapG₂′. The first-direction target gap G₁′ and the second-direction targetgap G₂′ are smaller than the corresponding first-direction initial gapG₁ and the corresponding second-direction initial gap G₂. Furthermore,the first-direction target gap G₁′ corresponds to the wire diameter ofthe second conductive wires 32 and the second-direction target gap G₂′corresponds to the wire diameter of the first conductive wires 31,wherein the first conductive wires 31 and the second conductive wires 32may have substantially the same or different wire diameters. The size ofthe grids 33 defined by the first and the second conductive wires 31 and32 after contraction in size may be substantially the same or slightlylarger than the size of the upper surface 111 of each micro-componentdevice 10. Because the first conductive wires 31 are substantiallyperpendicular to the second conductive wires 32, the orientation of themicro-component devices 10 formed as a higher-precision array can becontrolled within ±10 degrees, ±5 degrees, or ±1 degree.

According to Ampère's force law:

${\frac{F}{\Delta L} = \frac{\mu_{0}I_{1}I_{2}}{2{\pi r}}},$the electromagnetic force F generated by two adjacent and parallelcurrent-carrying conductive wires (e.g., the first conductive wires 31or the second conductive wires 32) can be calculated, wherein: I₁ and I₂are the DC currents of the two parallel current-carrying conductivewires, ΔL is the length of the current-carrying conductive wires, r isthe distance between the two current-carrying conductive wires, and tois the vacuum permeability.

The electromagnetic force F₁ and F₂ generated by the first conductivewires 31 and the second conductive wires 32 will be described below bytaking a 5.5″ display size with a resolution of 1920×1080 as an example.

As shown in FIG. 4A, the floating micro-component devices 10 are firstarranged as a lower-density array with the first-direction initial gapG₁ and the second-direction initial gap G₂ (having an array size ofabout 151.1 mm×about 268.7 mm). The center distance r₂ between theadjacent first conductive wires 31 and the center distance r₁ betweenthe adjacent second conductive wires 32 are set to about 139 μm. Thewire diameter of the first conductive wire 31 and the second conductivewire 32 made of copper is selected to be about 20.3 μm. Therefore, thefirst conductive wires 31 and the second conductive wires 32 with about20 μm in wire diameter have a burn-out current of about 460 mA. As shownin FIG. 6D, the DC currents I₁ and I₂ are set to about 350 mA, whichdoes not exceed the burn-out current; and the micro-component devices 10are actuated to move closer and arranged in a higher array density withthe first-direction target gap G₁′ and the second-direction target gapG₂′. This arranged array has an array size of about 68.5 mm×about 121.8mm, and the center distance r₁ and r₂ are reduced from about 139 μm toabout 63 μm.

The above values are summarized in the Table 1. According to Ampère'slaw, the electromagnetic force F₁ of the first conductive wires 31 isabout 0.0027 g, and the electromagnetic force F₂ of the secondconductive wires 32 is about 0.0048 g.

TABLE 1 Lower-density Higher-density Array Array Unit I₁ 0.35 0.35 A I₂0.35 0.35 A r₂ 0.000139 0.000063 m (center distance between the firstconductive wires 31) r₁ 0.000139 0.000063 m (center distance between thesecond conductive wires 32) μ₀  1.2566E−06  1.2566E−06 N/A₂ ΔL₁ (ArrayWidth) 0.1511 0.0685 m ΔL₂ (Array Length) 0.2687 0.1218 m F₁/ΔL₁ (Width)1.76259E−04 3.88889E−04 N/m F₂/ΔL₂ (Length) 1.76259E−04 3.88889E−04 N/mF₁ (Width) 2.71717E−03 * g F₂ (Length) 4.83140E−03 * g

The electromagnetic force F₁ is generated between a first one and anadjacent second one of the conductive wires 31, and also generatedbetween the first one and a third one of the conductive wires 31, andalso generated between the first one and a fourth one of the conductivewires 31, and so forth. Therefore, as shown in Table 2, when theelectromagnetic force is generated by one hundred current-carrying onesof the first conductive wires 31, the total accumulated electromagneticforce F₁ is about 5.19 times of that generated between two adjacent onesof the first conductive wires 31. That is, the total accumulatedelectromagnetic force F₁ is about 0.0141 g. Similarly, when theelectromagnetic force is generated by one hundred current-carrying onesof the second conductive wires 32, the total accumulated electromagneticforce F₂ is about 5.19 times of that generated between two adjacent onesof the second conductive wires 32. That is, the total accumulatedelectromagnetic force F₂ is about 0.0251 g. Therefore, theelectromagnetic forces F₁ and F₂ of the first conductive wires 31 andthe second conductive wires 32 are sufficient to actuate the floatingmicro-component devices 10 to be moving closer to each other to form ahigher-precision arranged array.

TABLE 2 Normalized electromagnetic force F₁ of the No. of the first No.of conductive wires 31 relative to Accumulated current-carrying first apair of adjacent conductive Electromagnetic conductive wires 31 wire 31(%) Force 1 100 1 2 50 1.5 3 33 1.8333 4 25 2.08333 5 20 2.2833 10 102.9290 20 5 3.5977 30 3.3 3.9950 50 2.0 4.4992 100 1.0 5.1874

As illustrated in FIG. 7A and FIG. 7B, process stage S109 (shown inFIG. 1) is followed by transferring the arranged array of themicro-component devices 10 onto a carrier substrate 50. Specifically, asshown in FIG. 7A, the carrier substrate 50 is disposed in the liquidsuspending medium 40F and under the micro-component devices 10. Thecarrier substrate 50 can be embodied as a plate 52 with an adhesive film51, or an adhesive film 51 alone. As shown in FIG. 7B, the liquidsuspending medium 40F is then drained to lower the micro-componentdevices 10 to settle on and contact the carrier substrate 50, and themicro-component devices 10 can be pressure-bonded to the carriersubstrate 50 from above using a pressing plate (not shown). During thetransfer process, the first conductive wires 31 and the secondconductive wires 32 are in a contraction state due to attraction forceamong wires 31 and 32 generated by the DC currents, and themicro-component devices 10 are still arranged at a high array densitywith the specified first-direction target gap G₁′ and the specifiedsecond-direction target gap G₂′.

In another embodiment (not shown), after the carrier substrate 50 isdisposed in the liquid suspending medium 40F, the carrier substrate 50can be actuated to move upward so that the adhesive film 51 of thecarrier substrate 50 is in contact with the set of electrodes 114 of themicro-component devices 10. The carrier substrate 50 can continue tomove up and leave the liquid suspending medium 40F with themicro-component devices 10. In this process, draining of the liquidsuspending medium 40F may be omitted. In yet another embodiment (notshown), the first conductive wires 31 and the second conductive wires 32of the conductive wire assembly 30 are actuated to move upward in thecontraction state together with the micro-component devices 10 and leavethe liquid suspending medium 40F. Then the micro-component devices 10are placed on the carrier substrate 50. In this process, draining of theliquid suspending medium 40F may be omitted, and the carrier substrate50 does not need to be disposed in the liquid suspending medium 40F.

As illustrated in FIG. 8A and FIG. 8B, the last process stage S111(shown in FIG. 1) is performed to remove the first conductive wires 31and the second conductive wires 32 of the conductive wire assembly 30.Specifically, the DC currents are ceased to be applied to the firstconductive wires 31 and the second conductive wires 32, and then thefirst conductive wires 31 and the second conductive wires 32 areactuated to move upward and leave (no longer surrounding) themicro-component devices 10. Thereafter, if the micro-component devices10 includes the auxiliary structures 12, the auxiliary structures 12 canbe removed (e.g., removed by process techniques such as photoresiststripping by etching or ashing) such that the LED chips 11 remain. Inthis way, a precisely arranged array of LED chips 11 with a specifiedtarget gap can be completed.

The arranged array of the LED chips 11 (or micro-component devices 10)on the carrier substrate 50 can then be subsequently transferred toanother application circuit board (not shown) comprising a drivingcircuit by a mass transfer technique. As shown in FIG. 7A to FIG. 7B, anapplication circuit board can also be directly used as the carriersubstrate 50. Therefore, the micro-component devices 10 are directlydisposed on the application circuit board while omitting another masstransfer process.

As illustrated from FIG. 9A to FIG. 9C, another embodiment of amicro-component device arrangement method is disclosed according to thepresent disclosure, and the technical details thereof can be referredto, understood or combined with the technical details of the arrangementmethod S100 described above. This arrangement method is similar to thearrangement method S100 and includes the same process stages S107 toS111. However, when the micro-component devices 10 are formed as alower-precision array, alternative process stages can be adopted and thetechnical details can be explained in the following.

As shown in FIG. 9A, a liquid suspending medium 40F having a higher massdensity is prepared, and then a plurality of micro-component devices 10are floated on the liquid suspending medium 40F. That is, themicro-component devices 10 are directly placed in the liquid suspendingmedium 40F for suspension, and use of a temporary carrier substrate 20is omitted. Further, when the micro-component devices 10 are disposed inthe liquid suspending medium 40F, the orientation of and the gaps amongthe micro-component devices 10 are not specifically set. That is, themicro-component devices 10 floating thereon may be disorderlydistributed and irregularly arranged.

Each micro-component device 10 includes the auxiliary structure 12having a lower mass density, and the auxiliary structure 12 furtherincludes a magnetic material mixed in a photoresist material. Themagnetic material 121 may include, for example, iron, cobalt, nickel, analloy thereof or a compound thereof, so that the auxiliary structure 12can generate a magnetic force while exposed to a magnetic field.Desirably, the magnetic material 121 may be a soft magnetic materialthat is prone to be magnetized and de-magnetized, and a magnetic fieldmay be imposed to align the magnetic moments of the magnetic material121 to generate magnetism. When the magnetic field is removed, themagnetic moment of the magnetic material 121 resumes to a disorderlyarrangement without magnetism.

As shown in FIG. 9B, when the micro-component devices 10 are floated onthe surface of the liquid suspending medium 40F, a magnetic field isapplied to the micro-component devices 10. A magnetic field generator60A, which can include a permanent magnet or an electromagnet, is usedto generate a specified magnetic field, and can be disposed above themicro-component devices 10. Alternatively, as shown in FIG. 9C, themagnetic field generator 60A can also be configured to surround themicro-component devices 10. The magnetic field provided by the magneticfield generator 60A can induce the magnetic material of the auxiliarystructure 12 to generate a magnetic field B. That is, each of themicro-component devices 10 induces a respective magnetic field B withsubstantially the same polarity; for example, the north pole N is facingupward and the south pole S is facing down. In other words, each of themicro-component devices 10 becomes a small magnet with substantially thesame polarity.

Since the micro-component devices 10 have magnetic fields B ofsubstantially the same polarity, a repulsive force Fr will be generatedbetween the micro-component devices 10 such that the micro-componentdevices 10 are actuated to move along the first direction D₁ and/or thesecond direction D₂. After the micro-component devices 10 have reachedan equilibrium state under the action of the mutual repulsive force Fr,the micro-component devices 10 may be arranged with the first-directioninitial gap G₁ along the first direction D₁ and arranged with thesecond-direction initial gap G₂ along the second direction D₂. Alower-precision array such as shown in FIG. 5A is formed accordingly.

As shown in FIG. 9D, in another embodiment, the auxiliary structure 12may not include the magnetic material 121, but may include a materialthat is prone to be induced by an electric field to generateelectrostatic charges, or contains an electrostatic induction material122 that is mixed in the auxiliary structure 12. After themicro-component devices 10 are disposed floating on the surface of theliquid suspending medium 40F, an electric field generator 60B can beused to generate an electric field acting on the micro-component devices10. The electric field generator 60B carries or generates electrostaticcharges E (e.g., a negative charge as illustrated in FIG. 9D), and canbe disposed above and/or below the micro-component devices 10.

After the electric field is applied, the electrostatic inductionmaterial 122 inside the auxiliary structure 12 generates oppositeelectrostatic charges E (for example, positive charges) by electrostaticinduction, so that the electrostatic charges E will be attractedproximal to the electric field generator 60B. Since the auxiliarystructure 12 has a local electric field generated by the induced chargesE, a mutual repulsive force Fr is generated among the micro-componentdevices 10, actuating the micro-component devices 10 to move along thefirst direction D₁ and/or along the second direction D₂. After themicro-component devices 10 have reached an equilibrium state under theaction of the mutual repulsive force Fr, the micro-component devices 10may be arranged with the first-direction initial gap G₁ along the firstdirection D₁ and arranged with the second-direction initial gap G₂ alongthe second direction D₂. A lower-precision array such as shown in FIG.5A is formed accordingly.

After the floating micro-component devices 10 are arranged into alower-precision array under the action of the mutual repulsive force Fr,the process stages of providing the conductive wire assembly (e.g., theabove process stages S103 to S111) can be used to continue thearrangement method. Further, when the process stage S103 of providingthe conductive wire assembly is performed, simultaneously, an additionalelectric or magnetic field is applied acting on the micro-componentdevices 10 until the micro-component devices 10 are actuated to moveinside the grids 33 of the conductive wire assembly 30 (as shown in FIG.4A).

Furthermore, by adjusting the magnitude of the applied electric ormagnetic field, and thereby controlling the distribution of the mutualrepulsive force Fr among the micro-component devices 10, themicro-component devices 10 can be directly arranged to be spaced apartwith the target gaps G₁′ and G₂′. Thus, the execution of the processstages such as S103: providing the conductive wire assembly 30, andS107: actuating the micro-component devices 10 to move closer can beomitted.

As illustrated in FIG. 10, a micro-component device arrangement system100D according to an embodiment of the present disclosure, which can beused to perform at least certain process stages of the micro-componentdevice arrangement method S100, will be described. Therefore, for thesake of brevity, the technical description of the micro-component devicearrangement system 100D can refer to the technical details of theabove-mentioned micro-component device arrangement method S100 (or viceversa).

The micro-component device arrangement system 100D at least includes aliquid chamber module 400D, a micro-component device arrangement module300D, a magnetic field generator 60A (and/or an electric field generator60B), and a control module 70. The liquid chamber module 400D caninclude a liquid chamber 40 that can accommodate the liquid suspendingmedium 40F. The micro-component devices 10 and the temporary carriersubstrate 20 (not shown) can be placed in the liquid chamber 40, and themicro-component devices 10 can be disposed to float on the liquidsuspending medium 40F (as shown in FIG. 5A).

Optionally, the liquid chamber module 400D further includes a firstvalve 41 and a second valve 42, which may be directly connected to theliquid chamber 40 or indirectly connected to the liquid chamber 40through a pipeline. When the second valve 42 is opened, the liquidsuspending medium 40F can be continuously injected into the liquidchamber 40, so that the liquid suspending medium 40F covers themicro-component devices 10 and/or the temporary carrier substrate 20.When the first valve 41 is opened, the liquid suspending medium 40F canbe drained from the liquid chamber 40 so that the micro-componentdevices 10 are lowered and contact the carrier substrate 50 (as shown inFIG. 7B). The liquid chamber module 400D further includes a liquid levelsensor 43 for sensing the liquid level of the liquid suspending medium40F, so that the control module 70 can utilize the liquid level tocoordinate the opening or closing of the first valve 41 and the secondvalve 42.

The micro-component device arrangement module 300D includes a conductivewire assembly 30 and a power supply 34. The conductive wire assembly 30includes a plurality of first conductive wires 31 and a plurality ofsecond conductive wires 32 (as shown in FIG. 4A), wherein both the firstconductive wires 31 and the second conductive wires 32 are disposed inthe liquid chamber 40. The conductive wire assembly 30 can be actuatedto move in the liquid chamber 40, and after the micro-component devices10 are disposed to float on the liquid suspending medium 40F, theconductive wire assembly 30 is actuated to surround the micro-componentdevices 10. The conductive wire assembly 30 can also be removed from theliquid chamber 40. The power supply 34 is electrically connected to theconductive wire assembly 30 to supply DC currents to the firstconductive wires 31 and the second conductive wires 32 to actuate thefirst conductive wires 31 and the second conductive wires 32 bygenerating attractive electromagnetic fields. The power supply 34 isconnected to both terminals of each of the first conductive wires 31 andthe second conductive wires 32.

The magnetic field generator 60A and/or the electric field generator 60B(as shown in FIG. 9C and/or FIG. 9D) can generate a uniform magneticfield and/or a uniform electric field in the liquid chamber 40, creatinga mutual repulsive force Fr among the micro-component devices 10. Thepower supply 34 can be electrically connected to the magnetic fieldgenerator 60A and/or the electric field generator 60B to supply DCcurrents to generate a magnetic field and/or an electric field. Themagnetic field generator 60A and/or the electric field generator 60B maybe disposed in the liquid chamber 40, but not in contact with the liquidsuspending medium 40F; or can be disposed outside the liquid chamber 40,for example, above or below the liquid chamber 40 or surrounding theliquid chamber 40.

The control module 70 is connected to and is configured to control andcoordinate the operation of the liquid chamber module 400D and themicro-component device arrangement module 300D, thereby automaticallyperforming the micro-component device arrangement method. For example,the control module 70 can control the opening and closing of the firstvalve 41 and the second valve 42, control the power supply 34 to supplyDC currents to the conductive wire assembly 30, the magnetic fieldgenerator 60A and/or the electric field generator 60B, and so forth. Thecontrol module 70 can include a programmable logic controller, amicroprocessor and an associated memory storing executable instructions,and so forth.

Accordingly, the system and the method for arranging micro-componentdevices according to some embodiments of the present disclosure canarrange the micro-component devices and form an array rapidly,conveniently, and accurately, so that subsequent processes such as masstransfer of the micro-component devices can be performed. Themicro-component devices can also be arranged directly on an applicationcircuit board to allow omission of another mass transfer process.

While the disclosure has been described with reference to the specificembodiments thereof, it should be understood by those skilled in the artthat various changes may be made and equivalents may be substitutedwithout departing from the true spirit and scope of the disclosure asdefined by the appended claims. In addition, many modifications may bemade to adapt a particular situation, material, composition of matter,method, or process to the objective, spirit and scope of the disclosure.All such modifications are intended to be within the scope of the claimsappended hereto. In particular, while the methods disclosed herein havebeen described with reference to particular operations performed in aparticular order, it will be understood that these operations may becombined, sub-divided, or re-ordered to form an equivalent methodwithout departing from the teachings of the disclosure. Accordingly,unless specifically indicated herein, the order and grouping of theoperations are not limitations of the disclosure.

What is claimed is:
 1. A method of arranging micro-component devices,comprising: disposing a plurality of micro-component devices to float ona liquid suspending medium, wherein the micro-component devices arespaced apart along a first direction by a first-direction initial gapand along a second direction by a second-direction initial gap, and thefirst direction is transverse to the second direction; actuating themicro-component devices floating on the liquid suspending medium to movecloser to each other such that the micro-component devices are spacedapart along the first direction by a first-direction target gap andalong the second direction by a second-direction target gap to form anarray of the micro-component devices, wherein the first-direction targetgap and the second-direction target gap are smaller than thecorresponding first-direction initial gap and the second-directioninitial gap; and transferring the array of the micro-component devicesonto a carrier substrate, wherein the first-direction target gap and thesecond-direction target gap are maintained.
 2. The method according toclaim 1, further comprising: providing a conductive wire assembly,wherein the conductive wire assembly includes a plurality of firstconductive wires along the first direction and a plurality of secondconductive wires along the second direction, the conductive wireassembly further defines a plurality of grids, and each of the grids isformed by two adjacent ones of the first conductive wires and twoadjacent ones of the second conductive wires; aligning themicro-component devices with the grids of the conductive wire assemblysuch that the micro-component devices are located inside respective onesof the grids of the conductive wire assembly; applying currents to thefirst conductive wires to generate magnetic fields and actuate the firstconductive wires to move closer to each other such that themicro-component devices are moved closer to each other along the seconddirection; and applying currents to the second conductive wires togenerate magnetic fields and actuate the second conductive wires to movecloser to each other such that the micro-component devices are movedcloser to each other along the first direction.
 3. The method accordingto claim 2, wherein the micro-component devices are floated on theliquid suspending medium after the micro-component devices are disposedto be located inside respective ones of the grids of the conductive wireassembly.
 4. The method according to claim 2, wherein themicro-component devices are located inside respective ones of the gridsof the conductive wire assembly after the micro-component devices aredisposed to float on the liquid suspending medium.
 5. The methodaccording to any one of claims 1 to 4, wherein disposing themicro-component devices to float on the liquid suspending medium furthercomprises: disposing the micro-component devices on a temporary carriersubstrate, wherein the micro-component devices are spaced apart alongthe first direction by the first-direction initial gap and along thesecond direction by the second-direction initial gap; immersing thetemporary carrier substrate in the liquid suspending medium; andreleasing the micro-component devices from the temporary carriersubstrate to be floating on the liquid suspending medium.
 6. The methodaccording to claim 5, wherein the micro-component devices are adhered tothe temporary carrier substrate or are adsorbed to the temporary carriersubstrate.
 7. The method according to any one of claims 1 to 4, whereineach of the micro-component devices comprises a light-emitting diode(LED) chip, the LED chip comprising an upper surface, a lower surface,an edge surface, and a set of electrodes, and the set of electrodes isdisposed on the lower surface.
 8. The method according to claim 7,wherein each of the micro-component devices further comprises anauxiliary structure disposed on the upper surface or disposed along theedge surface of the LED chip, and a mass density of the auxiliarystructure is less than a mass density of the LED chip.
 9. The methodaccording to claim 8, wherein the auxiliary structure comprises amagnetic material; wherein disposing the micro-component devices tofloat on the liquid suspending medium further comprises: applying amagnetic field to magnetize the auxiliary structures of themicro-component devices, such that repulsive forces are generated amongthe micro-component devices along the first direction and the seconddirection, and the micro-component devices are spaced apart by thefirst-direction initial gap and the second-direction initial gap. 10.The method according to claim 8, wherein disposing the micro-componentdevices to float on the liquid suspending medium further comprises:applying an electric field to induce electrostatic charges in theauxiliary structures of the micro-component devices, such that repulsiveforces are generated among the micro-component devices along the firstdirection and the second direction, and the micro-component devices arespaced apart by the first-direction initial gap and the second-directioninitial gap.
 11. The method according to claim 10, wherein the auxiliarystructures comprise an electrostatic induction material.
 12. The methodaccording to claim 8, further comprising removing the auxiliarystructures from the micro-component devices.
 13. The method according toany one of claims 1 to 4, wherein transferring the array of themicro-component devices onto the carrier substrate comprises: placingthe carrier substrate below the micro-component devices; and drainingthe liquid suspending medium to lower the micro-component devices tosettle on the carrier substrate.
 14. A micro-component devicearrangement system comprising: a liquid chamber module comprising aliquid chamber to accommodate a liquid suspending medium; and amicro-component device arrangement module comprising a conductive wireassembly, wherein the conductive wire assembly comprises a plurality offirst conductive wires along a first direction and a plurality of secondconductive wires along a second direction, the first conductive wiresand the second conductive wire are disposed in the liquid chamber, andthe first direction is transverse to the second direction; wherein: theconductive wire assembly defines a plurality of grids, each of the gridsbeing defined by two adjacent ones of the first conductive wires and twoadjacent ones of the second conductive wires.
 15. The micro-componentdevice arrangement system according to claim 14, wherein themicro-component device arrangement module further comprises a powersupply, and the power supply is connected to the conductive wireassembly to apply currents to the first conductive wires and the secondconductive wires.
 16. The micro-component device arrangement systemaccording to claim 14, wherein the liquid chamber module furthercomprises a first valve and a second valve, wherein the first valve andthe second valve are connected to the liquid chamber, and are configuredto drain the liquid suspending medium from the liquid chamber and toinject the liquid suspending medium into the liquid chamber,respectively.
 17. The micro-component device arrangement systemaccording to any one of claims 14 to 16, further comprising at least oneof: a magnetic field generator to generate a magnetic field in theliquid chamber; or an electric field generator to generate an electricfield in the liquid chamber.
 18. The micro-component device arrangementsystem according to any one of claims 14 to 16, further comprising acontrol module connected to the liquid chamber module and themicro-component device arrangement module, the control module beingconfigured to control and coordinate operation of the liquid chambermodule and the micro-component device arrangement module.
 19. A methodof arranging micro-component devices, comprising: disposing a pluralityof micro-component devices to float on a liquid suspending medium,wherein the micro-component devices are spaced apart in an initial arrayhaving an initial density of the micro-component devices; actuating themicro-component devices floating on the liquid suspending medium to movecloser to each other such that the micro-component devices are spacedapart in a target array having a target density of the micro-componentdevices that is greater than the initial density; and transferring thearray of the micro-component devices onto a carrier substrate, whilemaintaining the target density.